PLENARY SPEAKERS

 
 

Tzyy-Sheng Jason Horng
IEEE Fellow,
Chair Professor, National Sun Yat-sen University

Topic: Enabling Ubiquitous Sensing with Wireless Internet Signals

Abstract

When something moves within a space that is covered by a wireless internet signal from a communication device such as Wi-Fi, the frequency of the signal when received by the communication device slightly changes as a result of the Doppler frequency shift, which may be detected by sensors. These sensors can operate anytime and anywhere because wireless internet signals are ubiquitous and always present in today’s internet age. This presentation introduces an injection-locking based radar sensor that uses wireless internet signals for sensing motion and vital signs, describing its system architecture, principles of sensing and experimental results. The demonstration includes the applications of the radar sensor to gesture control in, for example, swiping pages and playing games using hand gestures on a smart phone. This presentation also addresses the combined use of MIMO beamforming and machine learning techniques in this radar sensor to track people and identify their body postures, sign languages and vital signs.

Biography

Prof. T.-S. Jason Horng received the Ph.D. degree from the University of California, Los Angeles, CA, USA, in 1992. Since 1992, he has been with the Department of Electrical Engineering, National Sun Yat-Sen University, Kaohsiung, Taiwan, where he was the Director of the Telecommunication Research and Development Center from 2003 to 2008, the Director of the Institute of Communications Engineering from 2004 to 2007, and is currently a Chair Professor. His research expertise covers microwave systems for wireless communications and Doppler radars for biomedical applications. He has co-authored two books and over 250 technical publications in refereed journals and conference proceedings. He holds over 50 worldwide patents. He has served on the technical program committees of many international conferences including the IEEE Region 10 International Technical Conference, the IEEE International Workshop on Electrical Design of Advanced Packaging and Systems, the IEEE Radio and Wireless Symposium, the IEEE International Symposium on Radio-Frequency Integration Technology, the IEEE Electronic Components and Technology Conference, and the Asia-Pacific Microwave Conference. He was also on the Project Review Board of the Engineering Programs at the Ministry of Science and Technology, Taiwan, for more than 10 years, where he was a Convener of the Communications Engineering Program from 2018 to 2020. He was the recipient of the 1996 Young Scientist Award from the International Union of Radio Science, the 1998 Industry-Education Cooperation Award from the Ministry of Education, Taiwan, the 2011 Chair Professorship awarded by Advanced Semiconductor Engineering, Inc., the 2012 Outstanding Research Award from National Sun Yat-Sen University, and the 2015-2020 Outstanding Research Awards, the 2020 Future Technology Award and the 2020 Most Influential Research Monograph Award from the Ministry of Science and Technology. Dr. Horng was the founder chair of the IEEE MTT-S Tainan Chapter in 2009, and an Associate Editor of the IEEE Transactions on Microwave Theory and Techniques from 2012 to 2015. He is now a Fellow of IEEE.

 
 
Herbert Zirath
IEEE Fellow
Head of Microwave Electronics Laboratory, Department of Microtechnology and Nanoscience (MC2),
Professor, Chalmers University of Technology
Topic: III-V and SiGe Transceivers for High Data Rate Millimeterwave Communications and Sensing

Abstract:

The transmission rate of wireless data in the mobile networks is doubling every year due to the increased usage of mobile multimedia services like streaming video, music, television, data transfer in smartphones and laptop-computers etc. This tendency will require continuously improved telecom infrastructure regarding both base-stations and the backhaul communication links. Today, the E-band (71-76, 81-86, 92-95 GHz) is employed increasingly in the networks, allowing multi Gbps data rate. In a near future however, the E-band will be crowded, and novel, higher frequency bands can to be employed as well. Several hundred Gigahertz bandwidth is available for new communication and sensing applications just waiting to be exploited at frequencies above 100 GHz. Until now, components for making such ‘THz-systems’ have been too expensive, too bulky, too power hungry and nonsufficient in terms of generating enough power for communication systems. With newly developed RFIC-processes, it is now possible to design multifunctional integrated circuits, realizing a full ‘frontend on a chip’ at frequencies well beyond 100 GHz. Recent results from ongoing projects aiming at enabling new applications for next generation mobile infrastructure, 6G, and imaging, up to 340 GHz will be reported. So far, critical building blocks such as LNA, PA, VCO, modulator and demodulator, frequency multiplier, power detector and mixer have recently been developed, and results will be reported. Multifunction front-end circuits such as complete receive and transmit RFICs, mixed signal designs for co-integrated baseband/frontend ICs, and radiometer ICs have also been developed and will be reported as well, including the newly developed D-band frontend chipset demonstrating state-of-the-art bitrate of beyond 40 Gbps.

Biography:

He is since 1996 Professor in High Speed Electronics at the Department of Microtechnology and Nanoscience, MC2, at Chalmers University. His main research interests include MMIC designs for wireless communication and sensor applications based on III-V, III-N, Graphene, and silicon devices. He is author/co-author of more than 600 refereed journal/conference papers, h-index of 48, and holds 5 patents. At the moment, his main focus is to develop highly integrated front-end receive/transmit chip-sets for high data rate communication and radar applications in the D/G/H-bands 110-325 GHz.

He is a co-founder of Gotmic AB, a company developing highly integrated frontend MMIC chip-sets for 60 GHz and E-band wireless communication.