Topics of interest include but not limited to:

  • Device Technologies: CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN, MEMS, reliability, characterization
  • Modeling and CAD: active/passive device modeling, CAD, EM simulation, co-simulation
  • Packaging Technology: MCM, SiP, TSV, flip chip assembly, wire bonding, anisotropic conductive film
  • Passive Circuits and Antenna: on-chip antennas, integrated passive devices, ferrite, piezoelectric material
  • Frequency Generation and Conversion ICs: VCOs, PLLs, synthesizers, ADPLLs, frequency dividers/multipliers, mixers
  • Front-end RFICs: LNAs, VGAs, phase shifters, RF switches
  • Power ICs: power amplifiers, linearization circuits, drivers
  • Millimeter-wave and THz ICs: circuits operating at mm-wave (30-300 GHz) and sub-mm-wave (>300 GHz) bands
  • Analog and Mixed Signal ICs: ADC, DAC, comparators, filters, AGC/VGA
  • High-Speed Data Transceivers: wireless/wireline/optical transceivers, CDRs for high-speed data links
  • Power Transmission ICs: RFIDs, electric coupling, electromagnetic induction, magnetic resonance, wireless power transmission ICs
  • Emerging ICs: power management, digital RF circuits/architectures, RF BIST, reconfigurable and tunable ICs, vehicle electronic ICs
  • Radio-Integrated Systems: IoT/M2M, automotive radars, wearable devices, security, biomedical and health care applications
  • 5G/B5G/6G Systems: MIMO systems, smart radio systems, cube satellite, and satellite communication systems